Title :
Aluminum Interconnections and Beam Leads on Polymide-Coated Copper Substrates
Author :
Bachner, Frank J.
fDate :
6/1/1972 12:00:00 AM
Keywords :
Aluminum; Apertures; Copper; Dielectric substrates; Gold; Heat sinks; Integrated circuit interconnections; Lead; Polyimides; Sputter etching;
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
DOI :
10.1109/TPHP.1972.1136565
