DocumentCode

968640

Title

Aluminum Interconnections and Beam Leads on Polymide-Coated Copper Substrates

Author

Bachner, Frank J.

Author_Institution

MIT

Volume

8

Issue

2

fYear

1972

fDate

6/1/1972 12:00:00 AM

Firstpage

30

Lastpage

34

Keywords

Aluminum; Apertures; Copper; Dielectric substrates; Gold; Heat sinks; Integrated circuit interconnections; Lead; Polyimides; Sputter etching;

fLanguage

English

Journal_Title

Parts, Hybrids, and Packaging, IEEE Transactions on

Publisher

ieee

ISSN

0361-1000

Type

jour

DOI

10.1109/TPHP.1972.1136565

Filename

1136565