DocumentCode :
968650
Title :
Bonded Crossovers for Thin Film Circuits
Author :
Burns, J.A.
Author_Institution :
Western Elec. Co., Inc.
Volume :
8
Issue :
2
fYear :
1972
fDate :
6/1/1972 12:00:00 AM
Firstpage :
35
Lastpage :
38
Keywords :
Bonding; Copper; Etching; Gold; Manufacturing; Polyimides; Resists; Solid state circuits; Substrates; Thin film circuits;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1972.1136566
Filename :
1136566
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=968650
