Title :
Thermal Characteristics of Beam-Lead Chips
Author :
Gower, Robert L.
Author_Institution :
Texas Instr., Inc.
fDate :
6/1/1972 12:00:00 AM
Abstract :
An experimental study of the thermal impedance characteristics of beam-lead chips is presented. A comparison of the thermal impedance of the 2N2222 and 2N3725 and the beam-lead equivalents of these devices is made. The beam-lead B2T2222 is used as a test vehicle to evaluate the effect of chip area, beam design, substrate temperature, and conformal coatings on the thermal impedance of beam-lead chips. Thermal impedance data for use in designing hybrid circuits with beam-lead devices are included.
Keywords :
Circuits; Coatings; Gold; Impedance; Instruments; Platinum; Semiconductor device measurement; Silicon; Substrates; Thermal resistance;
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
DOI :
10.1109/TPHP.1972.1136567
