DocumentCode
968659
Title
Thermal Characteristics of Beam-Lead Chips
Author
Gower, Robert L.
Author_Institution
Texas Instr., Inc.
Volume
8
Issue
2
fYear
1972
fDate
6/1/1972 12:00:00 AM
Firstpage
39
Lastpage
43
Abstract
An experimental study of the thermal impedance characteristics of beam-lead chips is presented. A comparison of the thermal impedance of the 2N2222 and 2N3725 and the beam-lead equivalents of these devices is made. The beam-lead B2T2222 is used as a test vehicle to evaluate the effect of chip area, beam design, substrate temperature, and conformal coatings on the thermal impedance of beam-lead chips. Thermal impedance data for use in designing hybrid circuits with beam-lead devices are included.
Keywords
Circuits; Coatings; Gold; Impedance; Instruments; Platinum; Semiconductor device measurement; Silicon; Substrates; Thermal resistance;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1972.1136567
Filename
1136567
Link To Document