DocumentCode

968713

Title

Foreword: Special Issue on Hybrid Microelectronics

Author

Sobol, H.

Author_Institution

Guest Editor

Volume

8

Issue

3

fYear

1972

fDate

9/1/1972 12:00:00 AM

Firstpage

3

Lastpage

3

Keywords

Bonding; Circuits; Electronic components; Electronics industry; Electronics packaging; Microelectronics; Silicon; Sputtering; Substrates; Transactions Committee;

fLanguage

English

Journal_Title

Parts, Hybrids, and Packaging, IEEE Transactions on

Publisher

ieee

ISSN

0361-1000

Type

jour

DOI

10.1109/TPHP.1972.1136573

Filename

1136573