DocumentCode
968848
Title
The Relation of Ceramics Processing to Materials Properties for Electronic Applications
Author
Bradley, Fennimore N.
Author_Institution
Michigan Technological Univ., Houghton, MI
Volume
8
Issue
4
fYear
1972
fDate
12/1/1972 12:00:00 AM
Firstpage
15
Lastpage
23
Abstract
General properties of electronic ceramics are examined, noting especially their influence upon fabrication economics and quality. Particular emphasis is placed upon the preparation of sinterable powders to attain high densification. The effects of fabrication technique and powder preparation upon ceramic quality and dimensional control are pointed out. Recent developments and possible future trends in electronic ceramic materials are discussed briefly.
Keywords
Bonding; Ceramics; Crystals; Electron mobility; Fabrication; Material properties; Polymers; Powders; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1972.1136586
Filename
1136586
Link To Document