• DocumentCode
    968848
  • Title

    The Relation of Ceramics Processing to Materials Properties for Electronic Applications

  • Author

    Bradley, Fennimore N.

  • Author_Institution
    Michigan Technological Univ., Houghton, MI
  • Volume
    8
  • Issue
    4
  • fYear
    1972
  • fDate
    12/1/1972 12:00:00 AM
  • Firstpage
    15
  • Lastpage
    23
  • Abstract
    General properties of electronic ceramics are examined, noting especially their influence upon fabrication economics and quality. Particular emphasis is placed upon the preparation of sinterable powders to attain high densification. The effects of fabrication technique and powder preparation upon ceramic quality and dimensional control are pointed out. Recent developments and possible future trends in electronic ceramic materials are discussed briefly.
  • Keywords
    Bonding; Ceramics; Crystals; Electron mobility; Fabrication; Material properties; Polymers; Powders; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1972.1136586
  • Filename
    1136586