DocumentCode :
968848
Title :
The Relation of Ceramics Processing to Materials Properties for Electronic Applications
Author :
Bradley, Fennimore N.
Author_Institution :
Michigan Technological Univ., Houghton, MI
Volume :
8
Issue :
4
fYear :
1972
fDate :
12/1/1972 12:00:00 AM
Firstpage :
15
Lastpage :
23
Abstract :
General properties of electronic ceramics are examined, noting especially their influence upon fabrication economics and quality. Particular emphasis is placed upon the preparation of sinterable powders to attain high densification. The effects of fabrication technique and powder preparation upon ceramic quality and dimensional control are pointed out. Recent developments and possible future trends in electronic ceramic materials are discussed briefly.
Keywords :
Bonding; Ceramics; Crystals; Electron mobility; Fabrication; Material properties; Polymers; Powders; Thermal conductivity; Thermal resistance;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1972.1136586
Filename :
1136586
Link To Document :
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