DocumentCode :
969674
Title :
On Using Strain Gauges in Electronic Assemblies When Temperature Is Not Constant
Author :
Hall, Peter M. ; Deighan, Richard A., III
Author_Institution :
Bell Laboratories, PA
Volume :
9
Issue :
4
fYear :
1986
fDate :
12/1/1986 12:00:00 AM
Firstpage :
492
Lastpage :
497
Abstract :
In a previous paper we presented this equation for processing strain gauge readings when the temperature is changing:E = Egauge reading-Eapparent strain+Estandard material Second-order corrections to this equation are presented, and the size of the corrections and their uncertainties are estimated. Included are measurements on NBS standard reference materials (Cu and glass), which verify the accuracy of the method to within about +60 ppm (i.e., 60 microstrain) for the range -25° to + 125°C.
Keywords :
Integrated circuit bonding; Integrated circuit thermal factors; Printed circuits; Strain measurements; Assembly; Capacitive sensors; Concrete; Equations; Measurement standards; NIST; Pulp manufacturing; Strain measurement; Temperature dependence; Temperature sensors;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1986.1136667
Filename :
1136667
Link To Document :
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