• DocumentCode
    969674
  • Title

    On Using Strain Gauges in Electronic Assemblies When Temperature Is Not Constant

  • Author

    Hall, Peter M. ; Deighan, Richard A., III

  • Author_Institution
    Bell Laboratories, PA
  • Volume
    9
  • Issue
    4
  • fYear
    1986
  • fDate
    12/1/1986 12:00:00 AM
  • Firstpage
    492
  • Lastpage
    497
  • Abstract
    In a previous paper we presented this equation for processing strain gauge readings when the temperature is changing:E = Egauge reading-Eapparent strain+Estandard material Second-order corrections to this equation are presented, and the size of the corrections and their uncertainties are estimated. Included are measurements on NBS standard reference materials (Cu and glass), which verify the accuracy of the method to within about +60 ppm (i.e., 60 microstrain) for the range -25° to + 125°C.
  • Keywords
    Integrated circuit bonding; Integrated circuit thermal factors; Printed circuits; Strain measurements; Assembly; Capacitive sensors; Concrete; Equations; Measurement standards; NIST; Pulp manufacturing; Strain measurement; Temperature dependence; Temperature sensors;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1986.1136667
  • Filename
    1136667