DocumentCode
969674
Title
On Using Strain Gauges in Electronic Assemblies When Temperature Is Not Constant
Author
Hall, Peter M. ; Deighan, Richard A., III
Author_Institution
Bell Laboratories, PA
Volume
9
Issue
4
fYear
1986
fDate
12/1/1986 12:00:00 AM
Firstpage
492
Lastpage
497
Abstract
In a previous paper we presented this equation for processing strain gauge readings when the temperature is changing:E = Egauge reading-Eapparent strain+Estandard material Second-order corrections to this equation are presented, and the size of the corrections and their uncertainties are estimated. Included are measurements on NBS standard reference materials (Cu and glass), which verify the accuracy of the method to within about +60 ppm (i.e., 60 microstrain) for the range -25° to + 125°C.
Keywords
Integrated circuit bonding; Integrated circuit thermal factors; Printed circuits; Strain measurements; Assembly; Capacitive sensors; Concrete; Equations; Measurement standards; NIST; Pulp manufacturing; Strain measurement; Temperature dependence; Temperature sensors;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1986.1136667
Filename
1136667
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