DocumentCode :
969908
Title :
Foreword
Author :
Gedney, R. ; Palkuti, L.
Author_Institution :
CHMT Guest Editor, 1986
Volume :
9
Issue :
4
fYear :
1986
fDate :
12/1/1986 12:00:00 AM
Firstpage :
327
Lastpage :
327
Keywords :
Capacitors; Ceramics; Connectors; Copper; Electronic packaging thermal management; Integrated circuit packaging; Lead; Optical fiber couplers; Optical fibers; Polyimides;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1986.1136691
Filename :
1136691
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=969908
