DocumentCode

969908

Title

Foreword

Author

Gedney, R. ; Palkuti, L.

Author_Institution

CHMT Guest Editor, 1986

Volume

9

Issue

4

fYear

1986

fDate

12/1/1986 12:00:00 AM

Firstpage

327

Lastpage

327

Keywords

Capacitors; Ceramics; Connectors; Copper; Electronic packaging thermal management; Integrated circuit packaging; Lead; Optical fiber couplers; Optical fibers; Polyimides;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/TCHMT.1986.1136691

Filename

1136691