Title :
Temperature Evaluation in Microelectronics Structures Using Analog Networks
fDate :
4/1/1965 12:00:00 AM
Abstract :
The steady-state and transient temperature elevations within a composite electronic or microelectronic structure can be analyzed by using a known method of converting a thermal system into an analog electrical system (Reference 1). The temoerature elevations are caused by heat generation and heat flow within an electronic structure and by convection and radiation heat flow away from the structure.
Keywords :
Boundary conditions; Computer networks; Differential equations; Heat sinks; Microelectronics; Power generation; Steady-state; Temperature; Thermal resistance; Transient analysis;
Journal_Title :
Product Engineering and Production, IEEE Transactions on
DOI :
10.1109/TPEP.1965.1136696
