DocumentCode :
970103
Title :
The Evaluation of Gold Electrodeposits for Use in Dry Circuit Applications
Author :
Baker, Richard G.
Author_Institution :
Bell Telephone Labs Inc., Murray Hill, NJ
Volume :
9
Issue :
1
fYear :
1973
fDate :
3/1/1973 12:00:00 AM
Firstpage :
36
Lastpage :
39
Abstract :
The methods commonly used to evaluate electrodeposits for electronic systems include characterization of the deposit itself, actual field exposures, and accelerated laboratory exposures. The importance of minimizing deposit porosity, using a diffusion barrier coating, and having a deposit with adequate resistance to wear tO insure long-term contact reliability is emphasized. The question of predicting useful field life from the results of accelerated laboratory exposures is considered. It cannot be done without sufficient comparisons between the results obtained in the real and simulated environments.
Keywords :
Electrodeposition; Gold; Semiconductor device contacts; Acceleration; Breakdown voltage; Chemical analysis; Circuits; Contact resistance; Corrosion; Electronic equipment; Gold; Laboratories; Transistors;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1973.1136711
Filename :
1136711
Link To Document :
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