DocumentCode
970103
Title
The Evaluation of Gold Electrodeposits for Use in Dry Circuit Applications
Author
Baker, Richard G.
Author_Institution
Bell Telephone Labs Inc., Murray Hill, NJ
Volume
9
Issue
1
fYear
1973
fDate
3/1/1973 12:00:00 AM
Firstpage
36
Lastpage
39
Abstract
The methods commonly used to evaluate electrodeposits for electronic systems include characterization of the deposit itself, actual field exposures, and accelerated laboratory exposures. The importance of minimizing deposit porosity, using a diffusion barrier coating, and having a deposit with adequate resistance to wear tO insure long-term contact reliability is emphasized. The question of predicting useful field life from the results of accelerated laboratory exposures is considered. It cannot be done without sufficient comparisons between the results obtained in the real and simulated environments.
Keywords
Electrodeposition; Gold; Semiconductor device contacts; Acceleration; Breakdown voltage; Chemical analysis; Circuits; Contact resistance; Corrosion; Electronic equipment; Gold; Laboratories; Transistors;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1973.1136711
Filename
1136711
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