• DocumentCode
    970103
  • Title

    The Evaluation of Gold Electrodeposits for Use in Dry Circuit Applications

  • Author

    Baker, Richard G.

  • Author_Institution
    Bell Telephone Labs Inc., Murray Hill, NJ
  • Volume
    9
  • Issue
    1
  • fYear
    1973
  • fDate
    3/1/1973 12:00:00 AM
  • Firstpage
    36
  • Lastpage
    39
  • Abstract
    The methods commonly used to evaluate electrodeposits for electronic systems include characterization of the deposit itself, actual field exposures, and accelerated laboratory exposures. The importance of minimizing deposit porosity, using a diffusion barrier coating, and having a deposit with adequate resistance to wear tO insure long-term contact reliability is emphasized. The question of predicting useful field life from the results of accelerated laboratory exposures is considered. It cannot be done without sufficient comparisons between the results obtained in the real and simulated environments.
  • Keywords
    Electrodeposition; Gold; Semiconductor device contacts; Acceleration; Breakdown voltage; Chemical analysis; Circuits; Contact resistance; Corrosion; Electronic equipment; Gold; Laboratories; Transistors;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1973.1136711
  • Filename
    1136711