DocumentCode :
970114
Title :
Free Convection Cooling of Electronic Systems
Author :
Aung, Win ; Kessler, T.J. ; Beitin, K.I.
Author_Institution :
Bell Telephone Lab., NJ
Volume :
9
Issue :
2
fYear :
1973
fDate :
6/1/1973 12:00:00 AM
Firstpage :
75
Lastpage :
86
Abstract :
Design criteria for free convection cooling c,f electronic systems are considered, The primary emphasis is on electronic equipment in which vertically oriented circuit cards are aligned to form vertical channels. Results of an experimental study utilizing a simulated electronic cabinet are discussed and compared with theoretical solutions obtained by numerical integration of the partial differential equations governing the heat transfer. Good agreement is shown between predicted and measured card temperatures for several different card spacings. Parametric effects on the maximum card temperature are given for card spacing, heat dissipation, and channel height. Nomograms are developed for rapid estimation of card temperatures and for choosing optimum card spacings. The effects of channel flow restrictions, staggered cards, and baffles are also discussed.
Keywords :
Convection cooling; Heat transfer; Thermal design; Circuit simulation; Electronic equipment; Electronics cooling; Laboratories; Partial differential equations; Power system reliability; Telephony; Temperature distribution; Temperature measurement; Thermal conductivity;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1973.1136712
Filename :
1136712
Link To Document :
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