• DocumentCode
    970162
  • Title

    A Stability Study of Laser-Patterned Thermally Stabilized Tantalum Nitride and Tantalum Aluminum Films

  • Author

    Barlage, F. Michael

  • Author_Institution
    Western Elec. Eng. Research Center, NJ
  • Volume
    9
  • Issue
    2
  • fYear
    1973
  • fDate
    6/1/1973 12:00:00 AM
  • Firstpage
    123
  • Lastpage
    130
  • Abstract
    Tantalum nitride and tantalum aluminum thin-film power resistors were reactively sputtered on 99+ percent alumina ceramic substrates in an argon atmosphere, thermally stabilized, and laser patterned into serpentine paths (two to ten meanders) to obtain final values two to two hundred times their initial values. The resistors were then subjected to many tests to determine their stability. Data from the load life test, after 5000 h at 13.3 W/in2 in a 66°C ambient, indicate that thermally stabilized tantalum nitride and tantalure aluminum resistors may be laser patterned without affecting the films´ intrinsic stability, provided certain constraints in the resistors´ geometry are recognized and observed by the designer.
  • Keywords
    Laser machining; Tantalum nitride films; Tantalum-aluminum films; Thin-film resistors; Aluminum; Argon; Atmosphere; Ceramics; Laser stability; Resistors; Sputtering; Substrates; Thermal resistance; Thermal stability;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1973.1136717
  • Filename
    1136717