• DocumentCode
    971189
  • Title

    Reliability of AuGe/Pt and AuGe/Ni ohmic contacts on GaAs

  • Author

    Lee, Charlotte P. ; Welch, B.M. ; Fleming, W.P.

  • Author_Institution
    Rockwell International, Microelectronics Research & Development Center, Thousand Oaks, USA
  • Volume
    17
  • Issue
    12
  • fYear
    1981
  • Firstpage
    407
  • Lastpage
    408
  • Abstract
    The reliability of AuGe/Pt and AuGe/Ni ohmic contacts with and without overlay metal (Ti/Au, Ti/Pt/Au or TiW/Au) has been studied. AuGe/Ni contacts have proved superior and more reliable than AuGe/Pt contacts with or without overlay. AuGe/Pt contacts are stable without overlay but degrade rapidly with overlay. AuGe/Ni contacts exhibit thermal stability after 1000 hours´ aging at 250°C.
  • Keywords
    gold compounds; nickel; ohmic contacts; platinum; reliability; AuGe-Ni ohmic contacts; AuGe-Pt ohmic contacts; GaAs; Ti-Au; Ti-Pt-Au; TiW-Au; reliability;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19810283
  • Filename
    4245754
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=971189