DocumentCode
971292
Title
Control of coercivity in NiFe films for single-level masking bubble devices
Author
Ahn, Kie Y. ; Tuxford, Anthony M.
Author_Institution
IBM Research Center, Yorktown Heights, NY, USA
Volume
15
Issue
2
fYear
1979
fDate
3/1/1979 12:00:00 AM
Firstpage
997
Lastpage
999
Abstract
Methods of reducing Hc in thick NiFe films deposited on evaporated Au have been studied for applications in conductor-first single-level masking bubble device fabrication. Results obtained using surface modification techniques, such as ion implantation, plasma etching, and semiconducting intermediate layers (TiOx ) are described. In addition, the performance of actual 5-μm and 2-μm devices is discussed.
Keywords
Coercive forces; Magnetic bubble device fabrication; Plasma applications, materials processing; Semiconductor films; Coercive force; Conductive films; Etching; Fabrication; Gold; Ion implantation; Plasma applications; Plasma devices; Plasma immersion ion implantation; Semiconductor films;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.1979.1060292
Filename
1060292
Link To Document