DocumentCode :
971292
Title :
Control of coercivity in NiFe films for single-level masking bubble devices
Author :
Ahn, Kie Y. ; Tuxford, Anthony M.
Author_Institution :
IBM Research Center, Yorktown Heights, NY, USA
Volume :
15
Issue :
2
fYear :
1979
fDate :
3/1/1979 12:00:00 AM
Firstpage :
997
Lastpage :
999
Abstract :
Methods of reducing Hcin thick NiFe films deposited on evaporated Au have been studied for applications in conductor-first single-level masking bubble device fabrication. Results obtained using surface modification techniques, such as ion implantation, plasma etching, and semiconducting intermediate layers (TiOx) are described. In addition, the performance of actual 5-μm and 2-μm devices is discussed.
Keywords :
Coercive forces; Magnetic bubble device fabrication; Plasma applications, materials processing; Semiconductor films; Coercive force; Conductive films; Etching; Fabrication; Gold; Ion implantation; Plasma applications; Plasma devices; Plasma immersion ion implantation; Semiconductor films;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.1979.1060292
Filename :
1060292
Link To Document :
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