Author :
Chitnis, A. ; Adivarahan, V. ; Zhang, J.P. ; Wu, S. ; Sun, J. ; Pachipulusu, R. ; Mandavilli, V. ; Gaevski, M. ; Shatalov, M. ; Asif Khan, M.
Keywords :
aluminium compounds; cooling; flip-chip devices; gallium compounds; light emitting diodes; thermal management (packaging); wide band gap semiconductors; 0.84 mW; 1 A; 180 mA; 325 nm; 6.68 mW; AlGaN; DC power; deep UV LEDs; flip-chip devices; output power; package heat dissipation; pulsed pump currents; sapphire substrate; thermal management study;