DocumentCode :
971952
Title :
Measurements of crosstalk between closely-packed lossy microstrips on silicon substrates
Author :
Lin, M.S. ; Engvik, A.H.
Author_Institution :
AT&T Bell Lab., Murray Hill, NJ, USA
Volume :
26
Issue :
11
fYear :
1990
fDate :
5/24/1990 12:00:00 AM
Firstpage :
714
Lastpage :
716
Abstract :
The measured near-end and far-end crosstalks for closely-packed microstrips are reported. The near-end crosstalk is less than 10% and the far-end crosstalk is less than 5% (of the driven signal) between two microstrips with 10 mu m width and 10 mu m spacing, when the active line is driven by a fast step pulse with approximately 40 ps rise time. Based on their measurements, the authors believe that closely-packed lossy microstrips can be used for high speed digital signal transmission, without much concern of crosstalk.
Keywords :
crosstalk; electromagnetic compatibility; silicon; strip lines; substrates; waveguide theory; 10 micron; 40 ps; Si substrates; VLSI chips interconnection; closely-packed lossy microstrips; closely-packed microstrips; crosstalk measurements; far-end crosstalk; fast step pulse; high speed digital signal transmission; near-end crosstalk; rise time; spacing; width;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19900466
Filename :
106035
Link To Document :
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