DocumentCode :
972164
Title :
Low-thermal-budget process modeling with the PREDICT computer program
Author :
Fair, Richard B.
Author_Institution :
Microelectron. Center of North Carolina, Research Triangle Park, NC, USA
Volume :
35
Issue :
3
fYear :
1988
fDate :
3/1/1988 12:00:00 AM
Firstpage :
285
Lastpage :
293
Abstract :
Low-thermal-budget processing models have been developed that are applicable to a broad range of ion-implantation and annealing conditions. The cases discussed here include low-temperature furnace annealing of B implants, preamorphization or postamorphization using Si + or Ge+ implants, and rapid thermal annealing of low-dose and high-dose implants. Annihilation of implant damage is accounted for through activated annealing models. Damage type and location in depth are important in understanding enhanced or retarded diffusion of dopants. Damage and diffusion models have been incorporated in the PREDICT program, and example calculations are compared with measurements
Keywords :
annealing; diffusion in solids; electronic engineering computing; incoherent light annealing; integrated circuit technology; ion implantation; semiconductor technology; Ge+; PREDICT computer program; Si; Si:B; Si+; activated annealing models; annealing conditions; diffusion models; implant damage annihilation; ion-implantation; low thermal budget process modelling; low-temperature furnace annealing; rapid thermal annealing; semiconductor technology; Furnaces; Implants; Microelectronics; Predictive models; Rapid thermal annealing; Rapid thermal processing; Semiconductor process modeling; Solids; Temperature; Very large scale integration;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.2452
Filename :
2452
Link To Document :
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