• DocumentCode
    972818
  • Title

    Annealing of Si3N4-capped ion-implanted InP

  • Author

    Gill, Sandeep Singh ; Sealy, B.J. ; Topham, P.J. ; Barrett, N.J. ; Stephens, K.G.

  • Author_Institution
    University of Surrey, Department of Electronic & Electrical Engineering, Guildford, UK
  • Volume
    17
  • Issue
    17
  • fYear
    1981
  • Firstpage
    623
  • Lastpage
    624
  • Abstract
    CVD-Si3N4 layers have been used to encapsulate Se+-implanted InP during annealing in the range 550°C to 730°C. Annealing at 700°C for about 3 min produced the best electrical properties for a dose of 1×1013 Se+ cm¿2, i.e. an electrical activity of 80% and and sheet mobility of 1400 cm2V¿1s¿1.
  • Keywords
    III-V semiconductors; annealing; indium compounds; ion implantation; selenium; 550degrees C to 730degrees C; CVD-Si3N4 layers; InP:Se+ III-V semiconductor; annealing; electrical activity; sheet mobility;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19810437
  • Filename
    4245913