• DocumentCode
    973036
  • Title

    A study of the corner effect in trench-like isolated structures

  • Author

    Vankemmel, Rudi C. ; De Meyer, Kristin M.

  • Author_Institution
    IMEC, Leuven, Heverlee, Belgium
  • Volume
    37
  • Issue
    1
  • fYear
    1990
  • fDate
    1/1/1990 12:00:00 AM
  • Firstpage
    168
  • Lastpage
    176
  • Abstract
    In trenchlike isolated devices, several parasitic effects exist. In a real-case test simulation, two such effects are shown. The most difficult to handle is the corner effect at the convex and concave corners in the structure. The corner effect is studied for two simple structures where no other parasitic effect exists. This makes it possible to look at the controlling factors of the effect and to formulate possible solutions of the corner effect. Results show that the corner effect is very strong, even with low gate bias and oxide charge density (Qf) values. To eliminate the inversion of the convex corner, doping levels higher than 1E17/cm3 are necessary when Qf⩾1E11/cm2. It is shown that rounding the convex corner is a very effective way to eliminate the effect. However, to minimize the area loss, a compromise must be chosen between the substrate doping concentration (N sub), oxide thickness, and rounding radius. Furthermore, the carrier concentration in the corner is controlled by the neighborhood of a biased drain (well). This can have an important influence on the leakage currents along a trench. The corner effect in a concave structure seems to have a very strong pinning function on the potential. Sharp corners prevent leakage currents around a trench, even with a relatively low Nsub
  • Keywords
    carrier density; insulated gate field effect transistors; leakage currents; semiconductor device testing; MOSFET; area loss; biased drain; carrier concentration; concave corners; controlling factors; convex corners; corner effect; doping levels; low gate bias; oxide charge density; oxide thickness; parasitic effects; pinning function; rounding; rounding radius; sharp corners; substrate doping concentration; test simulation; trench leakage currents; trenchlike isolated devices; Bipolar transistors; Dielectrics; Insulation; Isolation technology; MOS devices; Merging; Poisson equations; Potential well; Subthreshold current; Testing;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.43814
  • Filename
    43814