• DocumentCode
    973180
  • Title

    Microscale Liquid-Metal Switches—A Review

  • Author

    Sen, Prosenjit ; Chang-Jin Kim

  • Author_Institution
    Univ. of California, Los Angeles, CA
  • Volume
    56
  • Issue
    4
  • fYear
    2009
  • fDate
    4/1/2009 12:00:00 AM
  • Firstpage
    1314
  • Lastpage
    1330
  • Abstract
    Microelectromechanical systems (MEMS) have constituted an active R&D area over the last two to three decades, with one of the earliest application topics being microswitches. Typical designs involve actuation of microscale flexural elements (e.g., beams and membranes) to make a short or an opening in the transmission (signal) line. However, the problem of reliability of these switches persisted due to the presence of a solid-solid contact. Inspired by the regular mercury switches that use liquid-solid contact to solve the problems, several researchers have been exploring the use of liquid metal (LM) in developing microscale switches. Over time, the following two different approaches have evolved: LM-wetted microswitches and LM-actuated microswitches. In this paper, we summarize the progress of both approaches over the last decade by reporting a series of LM microswitches, each with the mechanism, fabrication, and performance. In addition, the properties of various LMs and LM alloys and the issues of fabrication and packaging involving LM are presented to help understand the reported developments as well as to assist in designing future LM microswitches.
  • Keywords
    liquid metals; microswitches; reliability; LM-actuated microswitches; LM-wetted microswitches; MEMS; microelectromechanical systems; microscale flexural elements; microscale liquid-metal switches; switch reliability; Liquid metal (LM); mercury switch; microelectromechanical systems (MEMS) switch; microswitch; reliability of microswitch;
  • fLanguage
    English
  • Journal_Title
    Industrial Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/TIE.2008.2006954
  • Filename
    4663713