• DocumentCode
    973373
  • Title

    A Multiple Particle Model for the Prediction of Electrical Contact Resistance in Anisotropic Conductive Adhesive Assemblies

  • Author

    Chin, Melida ; Hu, S. Jack

  • Author_Institution
    Michigan Univ., Ann Arbor
  • Volume
    30
  • Issue
    4
  • fYear
    2007
  • Firstpage
    745
  • Lastpage
    753
  • Abstract
    Accurate prediction of electrical contact resistance in anisotropic conductive adhesive (ACA) assemblies requires realistic models that include multiple particles between mating conductive tracks. In this paper, theoretical and finite element analyses are used to determine the electrical contact resistance in multiparticle ACA assemblies considering the effect of non-identical contact areas, elastic recovery, electrical interaction between the particles, and electrical interaction between the particles and the edges of the conductive tracks (edge effect). Parameters such as the number of particles, spatial distribution of the particles, and magnitude of the initial bonding force are evaluated. It is found that the spatial distribution of the particles plays a very important role in the rate at which the resistance decreases when either the number of particles or the magnitude of the initial bonding force is increased.
  • Keywords
    adhesive bonding; assembling; contact resistance; electrical contacts; electronics packaging; finite element analysis; anisotropic conductive adhesive assemblies; bonding force; edge effect; elastic recovery; electrical contact resistance; electrical interaction; finite element analysis; mating conductive tracks; multiparticle ACA assemblies; multiple particle model; nonidentical contact areas; spatial particle distribution; Anisotropic magnetoresistance; Assembly; Bonding forces; Conductive adhesives; Contact resistance; Elastic recovery; Electric resistance; Finite element methods; Particle tracking; Predictive models; Anisotropic conductive adhesive (ACA); bonding force; contact area; edge effect; elastic recovery; electrical contact resistance; electrical interaction; spatial distribution;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2007.910136
  • Filename
    4381433