DocumentCode
973373
Title
A Multiple Particle Model for the Prediction of Electrical Contact Resistance in Anisotropic Conductive Adhesive Assemblies
Author
Chin, Melida ; Hu, S. Jack
Author_Institution
Michigan Univ., Ann Arbor
Volume
30
Issue
4
fYear
2007
Firstpage
745
Lastpage
753
Abstract
Accurate prediction of electrical contact resistance in anisotropic conductive adhesive (ACA) assemblies requires realistic models that include multiple particles between mating conductive tracks. In this paper, theoretical and finite element analyses are used to determine the electrical contact resistance in multiparticle ACA assemblies considering the effect of non-identical contact areas, elastic recovery, electrical interaction between the particles, and electrical interaction between the particles and the edges of the conductive tracks (edge effect). Parameters such as the number of particles, spatial distribution of the particles, and magnitude of the initial bonding force are evaluated. It is found that the spatial distribution of the particles plays a very important role in the rate at which the resistance decreases when either the number of particles or the magnitude of the initial bonding force is increased.
Keywords
adhesive bonding; assembling; contact resistance; electrical contacts; electronics packaging; finite element analysis; anisotropic conductive adhesive assemblies; bonding force; edge effect; elastic recovery; electrical contact resistance; electrical interaction; finite element analysis; mating conductive tracks; multiparticle ACA assemblies; multiple particle model; nonidentical contact areas; spatial particle distribution; Anisotropic magnetoresistance; Assembly; Bonding forces; Conductive adhesives; Contact resistance; Elastic recovery; Electric resistance; Finite element methods; Particle tracking; Predictive models; Anisotropic conductive adhesive (ACA); bonding force; contact area; edge effect; elastic recovery; electrical contact resistance; electrical interaction; spatial distribution;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.910136
Filename
4381433
Link To Document