• DocumentCode
    974057
  • Title

    Single chip bubble memory packaging

  • Author

    Hayes, D.J.

  • Author_Institution
    Texas Instruments Incorporated, Dallas, Texas
  • Volume
    15
  • Issue
    6
  • fYear
    1979
  • fDate
    11/1/1979 12:00:00 AM
  • Firstpage
    1901
  • Lastpage
    1903
  • Abstract
    Single chip bubble memory packages are currently in production of Texas Instruments. The mechanical configuration of the packages and some of the assembly techniques will be shown in this paper. Thermal characteristics and magnetic shielding characteristics will be discussed to indicate the type of testing that is required to design an acceptable package. Finally environmental test results will be presented.
  • Keywords
    Magnetic bubble memories; Packaging; Assembly; Coils; Instruments; Magnetic shielding; Packaging; Production; Pulp manufacturing; Silicon alloys; Testing; Voltage;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.1979.1060530
  • Filename
    1060530
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=974057