DocumentCode :
974438
Title :
Low-Frequency-Noise Spectroscopy of SIMOX and Bonded SOI Wafers
Author :
Kushner, Vadim A. ; Park, Kihoon ; Schroder, Dieter K. ; Thornton, Trevor J.
Author_Institution :
Freescale Semicond. Inc., Tempe
Volume :
54
Issue :
12
fYear :
2007
Firstpage :
3378
Lastpage :
3382
Abstract :
Pseudo-MOSFET structures with metal source, drain, and guard electrodes are used to measure the low-frequency-noise characteristics of Separation by IMplantation of OXygen (SIMOX) and bonded silicon-on-insulator (SOI) wafers. The noise power spectra in the devices made from bonded SOI wafers are almost an order of magnitude lower than those made from SIMOX wafers. This is attributed to the lower interface trap density in the bonded wafers, which is extracted using the unified correlated model. The proposed method can be used to determine the 1/f noise characteristics of SOI wafers prior to circuit fabrication.
Keywords :
1/f noise; MOSFET; SIMOX; integrated circuit measurement; integrated circuit noise; silicon-on-insulator; 1/f noise characteristics; SIMOX wafers; bonded SOI wafers; circuit fabrication; interface trap density; low-frequency-noise spectroscopy; pseudo-MOSFET structures; separation by implantation of oxygen; silicon-on-insulator wafers; unified correlated model; Electrodes; Low-frequency noise; MOSFETs; Oxygen; Probes; Semiconductor device noise; Silicon on insulator technology; Spectroscopy; Substrates; Wafer bonding; Buried-oxide (BOX) traps; low-frequency noise (LFN); pseudo-MOSFET; silicon-on-insulator (SOI);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.908894
Filename :
4383035
Link To Document :
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