DocumentCode
976892
Title
Foreword
Author
Raad, Peter E. ; Volz, Sebastian
Volume
30
Issue
4
fYear
2007
Firstpage
595
Lastpage
596
Abstract
The thirty-six papers in this special section are devoted to thermal benchmarking.
Keywords
Diodes; Electronic packaging thermal management; Immune system; Photonic integrated circuits; Reflectometry; Temperature measurement; Temperature sensors; Thermal resistance; Transient analysis; Voltage;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.912044
Filename
4383344
Link To Document