Title :
Encapsulant-free annealing of ion-implanted GaP
Author :
Myers, D.R. ; Biefeld, R.M. ; Zipperian, T.E. ; Dawson, L.R.
Author_Institution :
Sandia National Laboratories, Albuquerque, USA
Abstract :
GaP diodes were fabricated by Mg+ implantation and controlled atmosphere annealing. At room temperature, these diodes emit green light under forward bias, with an ideality factor of 2.0. Reverse breakdown voltages are 180 V, with a measured reverse leakage current density of 4.8 à 10¿9 A/cm2 at a bias of ¿3 V. The diodes retain good electrical characteristics at 400°C.
Keywords :
III-V semiconductors; annealing; gallium compounds; ion implantation; magnesium; semiconductor technology; GaP LED; Mg+ implantation; controlled atmosphere annealing; encapsulant free annealing; high temperature electronics; ideality factor; ion-implanted GaP; operation to 400 degree C;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19820220