DocumentCode :
977170
Title :
Encapsulant-free annealing of ion-implanted GaP
Author :
Myers, D.R. ; Biefeld, R.M. ; Zipperian, T.E. ; Dawson, L.R.
Author_Institution :
Sandia National Laboratories, Albuquerque, USA
Volume :
18
Issue :
8
fYear :
1982
Firstpage :
323
Lastpage :
324
Abstract :
GaP diodes were fabricated by Mg+ implantation and controlled atmosphere annealing. At room temperature, these diodes emit green light under forward bias, with an ideality factor of 2.0. Reverse breakdown voltages are 180 V, with a measured reverse leakage current density of 4.8 × 10¿9 A/cm2 at a bias of ¿3 V. The diodes retain good electrical characteristics at 400°C.
Keywords :
III-V semiconductors; annealing; gallium compounds; ion implantation; magnesium; semiconductor technology; GaP LED; Mg+ implantation; controlled atmosphere annealing; encapsulant free annealing; high temperature electronics; ideality factor; ion-implanted GaP; operation to 400 degree C;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19820220
Filename :
4246352
Link To Document :
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