Reliability considerations in the design of one-megabit bubble memory chips

The trend toward increased density of magnetic bubble memory chips is motivated by lower cost per bit and, to a lesser extent, by lower power per bit. The design of large capacity chips must satisfy the requirements of high manufacturing yield, performance and long-term reliability. This paper describes how these requirements were met for the Intel Magnetics 7110 Bubble Memory through a cooperative design approach that involved both the bubble memory and the system support electronics chip set.