DocumentCode :
978380
Title :
Chip making´s wet new world
Author :
Geppert, L.
Volume :
41
Issue :
5
fYear :
2004
fDate :
5/1/2004 12:00:00 AM
Firstpage :
29
Lastpage :
33
Abstract :
Putting a drop of water between the lens and the silicon wafer allows a system to resolve lines a few hundred atoms wide. Researchers are counting on it to lift the technology from its last legs and carry it through the end of the decade.
Keywords :
integrated circuit technology; photolithography; wafer-scale integration; IC sites; immersion lithography; light beam; lithographic system; optical lithography; optical wavelength reduction; refractive index; wafer packaging; Business; Integrated circuit modeling; Integrated circuit technology; Lithography; Manufacturing; Optical films; Silicon; Space technology; Ultraviolet sources; Wires;
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.2004.1296011
Filename :
1296011
Link To Document :
بازگشت