• DocumentCode
    979343
  • Title

    Capillary bonded components for injection laser transmitter modules

  • Author

    Comerford, L.D. ; Brady, M.J.

  • Author_Institution
    IBM Thomas J. Watson Research Center, Yorktown Heights, USA
  • Volume
    18
  • Issue
    14
  • fYear
    1982
  • Firstpage
    629
  • Lastpage
    630
  • Abstract
    The packaging of semiconductor lasers with fibre-optic and electronic components is described, based on the use of an Si chip as a common substrate. The components are attached by flowing solder in grooves underneath the components by capillary action. The modules are small in dimension, and fabricated using automatable techniques for low cost.
  • Keywords
    modules; packaging; semiconductor junction lasers; Si chip; capillary bonded components; fibre optic transmitter; injection laser transmitter modules; packaging; semiconductor lasers; solder;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19820430
  • Filename
    4246568
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=979343