DocumentCode :
979603
Title :
A Second-Level SAC Solder-Joint Fatigue-Life Prediction Methodology
Author :
Dauksher, Walter
Author_Institution :
Avago Technol., Fort Collins
Volume :
8
Issue :
1
fYear :
2008
fDate :
3/1/2008 12:00:00 AM
Firstpage :
168
Lastpage :
173
Abstract :
An acceleration model is developed for relating existing second-level fatigue-life data of tin-silver-copper solder joints to untested environments. The acceleration model retains the familiar canonical form of the Norris-Landzberg equation. Model parameters are obtained through calibration with an extensive set of published empirical data. The model will find use in making rapid assessments of a product´s potential solder-joint field life based on accelerated product tests.
Keywords :
fatigue testing; reliability; solders; Norris-Landzberg equation; acceleration model; solder joint fatigue-life; solder joint field life; Fatigue; fatigue; lead-free; reliability; solder;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2007.912253
Filename :
4384315
Link To Document :
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