DocumentCode
979603
Title
A Second-Level SAC Solder-Joint Fatigue-Life Prediction Methodology
Author
Dauksher, Walter
Author_Institution
Avago Technol., Fort Collins
Volume
8
Issue
1
fYear
2008
fDate
3/1/2008 12:00:00 AM
Firstpage
168
Lastpage
173
Abstract
An acceleration model is developed for relating existing second-level fatigue-life data of tin-silver-copper solder joints to untested environments. The acceleration model retains the familiar canonical form of the Norris-Landzberg equation. Model parameters are obtained through calibration with an extensive set of published empirical data. The model will find use in making rapid assessments of a product´s potential solder-joint field life based on accelerated product tests.
Keywords
fatigue testing; reliability; solders; Norris-Landzberg equation; acceleration model; solder joint fatigue-life; solder joint field life; Fatigue; fatigue; lead-free; reliability; solder;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2007.912253
Filename
4384315
Link To Document