• DocumentCode
    981853
  • Title

    Nanopackaging Simulation

  • Author

    Bailey, Chris ; Lu, Hua

  • Volume
    3
  • Issue
    2
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    34
  • Lastpage
    37
  • Abstract
    Simulation tools as part of a virtual prototyping environment enable scientists and design engineers to answer "what-if" questions before actual costly experimentation and physical prototyping. Over the last 40 years, there has been an explosion in the use of simulation tools to predict electrical, thermal, and mechanical behavior of materials and the reliability of devices that contain microsystems. These tools are based on classical continuum mechanics (e.g., the finite element method), atomistic mechanics [e.g., classical molecular dynamics (MD)], or quantum mechanics (e.g., the density functional method). Figure 1 details the lengths and timescales at which each of these tools should be used.
  • Keywords
    Internet; circuit reliability; electronic engineering computing; electronics packaging; finite element analysis; nanotechnology; Web-based resource; electrical properties; electronics packaging; finite element methods; mechanical properties; microsystem reliability; nanopackaging simulation; nanoscale simulations; scale modeling packages; temperature gradients; thermal properties; Application software; Computational modeling; Finite element methods; Materials reliability; Mechanical factors; Nanocomposites; Packaging; Predictive models; Quantum mechanics; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1932-4510
  • Type

    jour

  • DOI
    10.1109/MNANO.2009.932413
  • Filename
    5036189