Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

Author

Fayette, Daniel F. ; Speicher, Patricia ; Stoklosa, Mark ; Evans, Jillian ; Evans, John ; Gentile, Mike ; Pagel, Chuck ; Hakim, Edward

Author_Institution

Rome Lab., Griffiss AFB, NY, USA

Volume

8

Issue

8

fYear

1993

Firstpage

32

Lastpage

38

Abstract

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screen criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.<>

Keywords

electronic equipment testing; hybrid integrated circuits; integrated circuit testing; multichip modules; production testing; reliability; standardisation; MIL-H-38534 general specification; accelerated testing; environmental testing; failure analysis; failure mechanisms; hybrid microcircuits; joint military-commercial effort; multichip module; packaging; post-test physical analysis; product evaluation; reliability modeling; standardization; Costs; Failure analysis; Hybrid integrated circuits; Life estimation; Multichip modules; Packaging; Qualifications; Standardization; Testing; Vehicles;

fLanguage

English

Journal_Title

Aerospace and Electronic Systems Magazine, IEEE

Publisher

ieee

ISSN

0885-8985

Type

jour

DOI

10.1109/62.248328

Filename

248328