Automatic assembly for microelectronic components

Author

Bien, Zeungnam ; Oh, Sang-Rok ; Suh, Hong, II ; Kim, Jae Ok ; Oh, Young Seok

Author_Institution

Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea

Volume

9

Issue

4

fYear

1989

fDate

6/1/1989 12:00:00 AM

Firstpage

15

Lastpage

19

Abstract

The design and development of an automatic assembly machine for microelectronic components is described. The machine uses multiple microprocessors to accomplish its tasks, which include process supervision, visual pattern recognition, and information display. The system is flexible and reliable due to its modular design and the use of a structured supervisor with diagnosis capability. It minimizes manual operation by means of automatic measurements and corrects object orientation and component size with the aid of a vision system. The control system was implemented in real time on a laboratory semiconductor die bonding machine. In a test, it was possible to reduce the bonding cycle time to 0.8 s/die (0.8-7.0 mm/sup 2/ sized die).<>

Keywords

computer vision; computerised control; lead bonding; microassembling; microcomputer applications; semiconductor device manufacture; automatic microassembly machine; control system; diagnosis capability; information display; modular design; process supervision; semiconductor die bonding machine; vision system; visual pattern recognition; Assembly; Automatic control; Control systems; Displays; Machine vision; Manuals; Microelectronics; Microprocessors; Pattern recognition; Size measurement;

fLanguage

English

Journal_Title

Control Systems Magazine, IEEE

Publisher

ieee

ISSN

0272-1708

Type

jour

DOI

10.1109/37.24833

Filename

24833