DocumentCode :
982550
Title :
High-efficiency GaAs power MESFETs prepared by ion implantation
Author :
Feng, Ming ; Kanber, H. ; Eu, V.K. ; Siracusa, M.
Author_Institution :
Hughes Aircraft Company, Torrance Research Center, Torrance, USA
Volume :
18
Issue :
25
fYear :
1982
Firstpage :
1097
Lastpage :
1099
Abstract :
GaAs power MESFETs have been fabricated using ion implantation to form channel layers. A 1 ¿m gate length by 2400 ¿m gate width device has demonstrated an output power of 1.63 W with 6.9 dB associated gain, 35% power-added efficiency and 9.7 dB linear gain at 10 GHz. The transconductance of this device is 280 mS, which corresponds to 117 mS/mm. This result demonstrates that excellent GaAs power MESFETs can be made by ion implantation, and is comparable to average results demonstrated by devices made by AsCl3 vapour phase epitaxy.
Keywords :
III-V semiconductors; Schottky gate field effect transistors; gallium arsenide; ion implantation; 10 GHz; GaAs power MESFETs; III-V semiconductor; channel layers; ion implantation; linear gain; power-added efficiency; transconductance;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19820749
Filename :
4247117
Link To Document :
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