DocumentCode
982851
Title
A Study of On-Chip Stacked Multiloop Spiral Inductors
Author
Yang, Kai ; Yin, Wen-Yan ; Shi, Jinglin ; Kang, Kai ; Mao, Jun-Fa ; Zhang, Y.P.
Author_Institution
Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Hong Kong
Volume
55
Issue
11
fYear
2008
Firstpage
3236
Lastpage
3245
Abstract
This paper proposes a new differential topology that features a stacked multiloop inductor. Comparative studies of stacked one- to four-loop spiral inductors with and without patterned ground shields (PGSs) for silicon-based radio-frequency integrated circuits (RFICs) were conducted, and lumped-element circuit models were developed for these inductors. The partial-element equivalent-circuit method that can accurately analyze mutual inductive couplings among different spirals in these multiloop geometries was employed for capturing the frequency-dependent inductances and resistances of inductors at low frequencies. A good agreement between numerical results and measurements is obtained. It is demonstrated that a stacked multiloop spiral inductor with differential topology and PGS has a larger inductance and a higher Q-factor as compared with the same inductor without differential topology and PGS. This hybrid methodology could provide a promising technique for developing new silicon-based passive devices used in RFICs.
Keywords
equivalent circuits; radiofrequency integrated circuits; differential topology; multiloop geometries; multiloop spiral inductors; mutual inductive couplings; on chip stacked; partial element equivalent circuit; patterned ground shields; radio frequency integrated circuits; Circuit topology; Coupling circuits; Electrical resistance measurement; Frequency; Geometry; Inductors; Integrated circuit modeling; Mutual coupling; Radiofrequency integrated circuits; Spirals; $Q$ -factor; Differential topology; inductance; partial-element equivalent-circuit (PEEC) method; patterned ground shields (PGSs); resistance; stacked multiloop spiral inductors;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2008.2004648
Filename
4668576
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