• DocumentCode
    983267
  • Title

    Monte Carlo simulation of ion implantation into two- and three-dimensional structures

  • Author

    Hobler, Gerhard ; Selberherr, Siegfried

  • Author_Institution
    Tech. Univ. of Vienna, Austria
  • Volume
    8
  • Issue
    5
  • fYear
    1989
  • fDate
    5/1/1989 12:00:00 AM
  • Firstpage
    450
  • Lastpage
    459
  • Abstract
    Until now, rigorous Monte Carlo simulations of ion implantation into 3-D structures have been prohibited by the large amount of computer time required, and 2-D simulations have been restricted to simple structures like linear mask edges or rectangular trenches. Methods are presented which made 2-D simulations with arbitrary geometries as well as 3-D simulations with simple geometries feasible. First, an auxiliary grid is used to reduce the time required to check whether an ion crosses a boundary. Second, each ion trajectory is used several times to determine the history of ions entering the target at different positions. The methods are demonstrated by three examples: implantation into a rectangular trench, implantation into a 2-D trench with nonplanar sidewalls, and implantation into a 3-D trench with quadratic cross section
  • Keywords
    Monte Carlo methods; computational complexity; digital simulation; ion implantation; semiconductor technology; 2-D structures; 2-D trench with nonplanar sidewalls; 3-D structures; 3-D trench; Monte Carlo simulation; auxiliary grid; computer time required; examples; history of ions; ion implantation; ion trajectory; quadratic cross section; rectangular trench; semiconductor implantation; simple geometries; three-dimensional structures; Boron; Computational modeling; Geometry; History; Ion implantation; Monte Carlo methods; Nonhomogeneous media; Semiconductor process modeling; Solid modeling; Surface treatment;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.24873
  • Filename
    24873