DocumentCode
983267
Title
Monte Carlo simulation of ion implantation into two- and three-dimensional structures
Author
Hobler, Gerhard ; Selberherr, Siegfried
Author_Institution
Tech. Univ. of Vienna, Austria
Volume
8
Issue
5
fYear
1989
fDate
5/1/1989 12:00:00 AM
Firstpage
450
Lastpage
459
Abstract
Until now, rigorous Monte Carlo simulations of ion implantation into 3-D structures have been prohibited by the large amount of computer time required, and 2-D simulations have been restricted to simple structures like linear mask edges or rectangular trenches. Methods are presented which made 2-D simulations with arbitrary geometries as well as 3-D simulations with simple geometries feasible. First, an auxiliary grid is used to reduce the time required to check whether an ion crosses a boundary. Second, each ion trajectory is used several times to determine the history of ions entering the target at different positions. The methods are demonstrated by three examples: implantation into a rectangular trench, implantation into a 2-D trench with nonplanar sidewalls, and implantation into a 3-D trench with quadratic cross section
Keywords
Monte Carlo methods; computational complexity; digital simulation; ion implantation; semiconductor technology; 2-D structures; 2-D trench with nonplanar sidewalls; 3-D structures; 3-D trench; Monte Carlo simulation; auxiliary grid; computer time required; examples; history of ions; ion implantation; ion trajectory; quadratic cross section; rectangular trench; semiconductor implantation; simple geometries; three-dimensional structures; Boron; Computational modeling; Geometry; History; Ion implantation; Monte Carlo methods; Nonhomogeneous media; Semiconductor process modeling; Solid modeling; Surface treatment;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/43.24873
Filename
24873
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