• DocumentCode
    983544
  • Title

    Design of Reflectionless Vias Using Neural Network-Based Approach

  • Author

    Hsu, Ku-Teng ; Guo, Wei-Da ; Shiue, Guang-Hwa ; Lin, Chien-Min ; Huang, Tian-Wei ; Wu, Ruey-Beei

  • Author_Institution
    ASUSTek Comput., Inc, Taipei
  • Volume
    31
  • Issue
    1
  • fYear
    2008
  • Firstpage
    211
  • Lastpage
    218
  • Abstract
    As the data rate is significantly increased, the effect of via discontinuity on the signal integrity of printed circuit boards has become more prominent and nonnegligible. In this paper, the artificial neural network approach to efficient design of reflection-less via structures with single-ended interconnections is presented. Full-wave analysis is employed to characterize the via structures, from which the empirical representation is derived using a neural network method with the physical parameters as inputs and the electrical characterization as the output. With the accurate and fast neural network models of desired via structures, one can rapidly determine the solution space of the feasible geometries with minimized reflection noise. The proposed approach is finally validated by the time-domain simulation results and time-domain reflection experiments.
  • Keywords
    interconnections; neural nets; printed circuit design; time-domain analysis; artificial neural network-based approach; empirical representation; full-wave analysis; printed circuit boards; reflection noise; reflectionless vias structures; signal integrity; single-ended interconnections; time-domain reflection; time-domain simulation; Artificial neural network (ANN); geometric design rules; reflection noise; sensitivity; signal integrity; time-domain reflection (TDR); via structure;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2007.908033
  • Filename
    4385533