DocumentCode
983544
Title
Design of Reflectionless Vias Using Neural Network-Based Approach
Author
Hsu, Ku-Teng ; Guo, Wei-Da ; Shiue, Guang-Hwa ; Lin, Chien-Min ; Huang, Tian-Wei ; Wu, Ruey-Beei
Author_Institution
ASUSTek Comput., Inc, Taipei
Volume
31
Issue
1
fYear
2008
Firstpage
211
Lastpage
218
Abstract
As the data rate is significantly increased, the effect of via discontinuity on the signal integrity of printed circuit boards has become more prominent and nonnegligible. In this paper, the artificial neural network approach to efficient design of reflection-less via structures with single-ended interconnections is presented. Full-wave analysis is employed to characterize the via structures, from which the empirical representation is derived using a neural network method with the physical parameters as inputs and the electrical characterization as the output. With the accurate and fast neural network models of desired via structures, one can rapidly determine the solution space of the feasible geometries with minimized reflection noise. The proposed approach is finally validated by the time-domain simulation results and time-domain reflection experiments.
Keywords
interconnections; neural nets; printed circuit design; time-domain analysis; artificial neural network-based approach; empirical representation; full-wave analysis; printed circuit boards; reflection noise; reflectionless vias structures; signal integrity; single-ended interconnections; time-domain reflection; time-domain simulation; Artificial neural network (ANN); geometric design rules; reflection noise; sensitivity; signal integrity; time-domain reflection (TDR); via structure;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2007.908033
Filename
4385533
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