• DocumentCode
    983677
  • Title

    A Novel Benzocyclobutene-Based Device for Studying the Dynamics of Heat Transfer During the Nucleation Process

  • Author

    Moghaddam, Saeed ; Kiger, Kenneth T. ; Modafe, Alireza ; Ghodssi, Reza

  • Author_Institution
    Adv. Thermal & Environ. Concepts, Inc., College Park
  • Volume
    16
  • Issue
    6
  • fYear
    2007
  • Firstpage
    1355
  • Lastpage
    1366
  • Abstract
    A novel microelectromechanical device has been developed to study the details of the heat transfer mechanisms involved at the nucleation site for the nucleate boiling process. This device enables quantifying the magnitude, time period of activation, and specific areas of influence of different mechanisms of heat transfer from the surface with a resolution several times greater than previously reported. This is achieved through the use of an array of embedded temperature sensors within a carefully designed dual-layer (silicon and benzocyclobutene) wall which allows for the accurate calculation of local heat flux, circumventing difficulties encountered when using existing methods. The sensors are radially distributed around the nucleation site. Heat is supplied to the wall by a thin film heater fabricated on the outer nonwetted surface. Single bubbles are generated at the center of the array while the temperatures and the bubble images are recorded with a sampling frequency of 8 kHz. The temperature data provided the necessary thermal boundary conditions to numerically calculate the surface heat flux with an unprecedented radial resolution of 22-40 mum. Fabrication, characterization, and the ability of the developed device to elucidate the heat transfer aspects of the nucleation process are demonstrated.
  • Keywords
    boiling; heat transfer; micromechanical devices; nucleation; organic compounds; temperature sensors; benzocyclobutene-based device; embedded temperature sensors; heat transfer dynamics; microelectromechanical device; nucleate boiling process; nucleation process; thermal boundary condition; Boundary conditions; Fabrication; Frequency; Heat transfer; Image sampling; Microelectromechanical devices; Sensor arrays; Silicon; Temperature sensors; Transistors; Boiling; bubble; heat transfer;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2007.907781
  • Filename
    4385545