• DocumentCode
    984065
  • Title

    On the Thermal Elevation of a 60-Electrode Epiretinal Prosthesis for the Blind

  • Author

    Singh, V. ; Roy, A. ; Castro, R. ; McClure, K. ; Dai, R. ; Agrawal, R. ; Greenberg, R.J. ; Weiland, J.D. ; Humayun, M.S. ; Lazzi, G.

  • Author_Institution
    Electr. & Comput. Eng. Dept., North Carolina State Univ., Raleigh, NC
  • Volume
    2
  • Issue
    4
  • fYear
    2008
  • Firstpage
    289
  • Lastpage
    300
  • Abstract
    In this paper, the thermal elevation in the human body due to the operation of a dual-unit epiretinal prosthesis to restore partial vision to the blind affected by irreversible retinal degeneration is presented. An accurate computational model of a 60-electrode device dissipating 97 mW power, currently under clinical trials is developed and positioned in a 0.25 mm resolution, heterogeneous model of the human head to resemble actual conditions of operation of the prosthesis. A novel simple finite difference scheme combining the explicit and the alternating-direction implicit (ADI) method has been developed and validated with existing methods. Simulation speed improvement up to 11 times was obtained for the the head model considered in this work with very good accuracy. Using this method, solutions of the bioheat equation were obtained for different placements of the implant. Comparison with in-vivo experimental measurements showed good agreement.
  • Keywords
    biomedical electrodes; biothermics; eye; finite difference methods; prosthetics; vision defects; alternating-direction implicit method; bioheat equation; dual-unit epiretinal prosthesis; finite difference scheme; heterogeneous model; implantable devices; irreversible retinal degeneration; thermal elevation; Biological system modeling; Clinical trials; Electrodes; Electronic packaging thermal management; Head; Humans; Implants; Photoreceptors; Prosthetics; Retina; Implantable devices; retinal prosthesis; thermal elevation;
  • fLanguage
    English
  • Journal_Title
    Biomedical Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1932-4545
  • Type

    jour

  • DOI
    10.1109/TBCAS.2008.2003430
  • Filename
    4669629