DocumentCode :
984130
Title :
Extension of the C-V doping profile technique to study the movements of alloyed junction and substrate out-diffusion, the separation of junctions, and device area trimming
Author :
Tantraporn, W. ; Glover, G.H.
Author_Institution :
Gen. Electr. Corp. Res. & Dev., Schenectady, NY, USA
Volume :
35
Issue :
4
fYear :
1988
fDate :
4/1/1988 12:00:00 AM
Firstpage :
525
Lastpage :
529
Abstract :
Digital data acquisition provides accurate data on capacitance vs. voltage (C-V) measurement and facilitates incorporation of improved analyses based on more complete models. The avalanche field check is an independent means of determining the junction area, and can be used as a quality-control indicator in device production or as a monitoring tool during area trimming of diodes hidden from view. Iterative fitting techniques can yield accuracies sufficient for studying alloyed junction movement from the C-V data. The nature of the doping profile in a nonabrupt junction can be inferred. The profile in the middle layer of a back-to-back junction structure in many practical cases can also be determined. Experimental examples are shown to support the interpretations
Keywords :
p-n homojunctions; quality control; semiconductor device manufacture; semiconductor diodes; C-V doping profile technique; avalanche field check; back-to-back junction structure; device area trimming; device production; digital data acquisition; experimental examples; incorporation of improved analyses; monitoring tool during area trimming; movements of alloyed junction; nonabrupt junction; quality-control indicator; separation of junctions; substrate out-diffusion; Capacitance; Capacitance-voltage characteristics; Data acquisition; Diodes; Doping profiles; Fitting; Monitoring; Production; Semiconductor process modeling; Voltage measurement;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.2491
Filename :
2491
Link To Document :
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