DocumentCode :
984214
Title :
The prediction of failure probability in anisotropic conductive adhesive (ACA)
Author :
Lin, Chao-Ming ; Su, Ming-Horng ; Chang, Win-Jin
Author_Institution :
Dept. of Mech. Eng., WuFeng Inst. of Technol., Chia-Yi, Taiwan
Volume :
5
Issue :
2
fYear :
2005
fDate :
6/1/2005 12:00:00 AM
Firstpage :
255
Lastpage :
261
Abstract :
This paper develops a model for predicting the failure probability of flip chip packaging using anisotropic conductive adhesive (ACA). The proposed approach modifies the box model to improve the accuracy of the bridging probability estimation by considering bridging in all directions. In the current failure analysis, probability theory is applied to calculate the probability of both opening and bridging failure. The Poisson distribution is used to calculate the probability of opening in the vertical gap between the pads, while the modified box model is used to estimate the probability of bridging between the pads. The results indicate that the modified box model provides an effective means of accurately estimating the probability of failure. The failure analysis takes the volume fraction of the conductive particles as the major variable in defining the optimal ACA design condition. A V-shaped curve model can be employed to establish an appropriate value of the volume fraction as a function of conductive particle radius, pitch, and pad dimensions such that the overall probability of failure is minimized.
Keywords :
Poisson distribution; electronics packaging; failure analysis; flip-chip devices; probability; Poisson distribution; anisotropic conductive adhesive; bridging probability estimation; current failure analysis; failure probability prediction; flip chip packaging; Anisotropic magnetoresistance; Assembly; Computer displays; Conductive adhesives; Conductivity; Failure analysis; Flip chip; Liquid crystal displays; Packaging; Probability; Anisotropic conductive adhesive (ACA); V-shaped curve; bridging; failure; flip chip packaging; opening; probability;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2005.846979
Filename :
1458742
Link To Document :
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