Title :
Implementations of smart pixels for optoelectronic processors and interconnection systems. I. Optoelectronic gate technology
Author :
Yu, Song ; Forrest, Stephen R.
Author_Institution :
Dept. of Electr. Eng., Princeton Univ., NJ, USA
fDate :
10/1/1993 12:00:00 AM
Abstract :
For part II see ibid., vol. 11, no. 10, pp. 1670-1680 (Oct. 1993). Several of the common approaches to smart pixel technology, including smart pixels based on optoelectronic integrated circuits and self-electrooptic effect devices (SEEDs), are studied. An optoelectronic NOR gate pixel consisting of an output laser diode, two input photodetectors, and a transistor circuit is analyzed for the purpose of investigating overall two-dimensional (2-D) interconnection and processing system performance. The major pixel performance issues are examined. The results show that the optoelectronic logic gate has the advantages of low noise (typically ~-35 dBm), high bandwidth (>1 GHz), and low temperature sensitivity, while its power dissipation is about 5 mW, resulting in a moderate pixel packing density of 200/cm2 for a total chip power dissipation of 1 W/cm2
Keywords :
integrated optoelectronics; optical interconnections; optical logic; photodetectors; semiconductor device noise; semiconductor lasers; sensitivity; 2D interconnection systems; 5 mW; SEEDs; high bandwidth; input photodetectors; interconnection systems; low noise; low temperature sensitivity; moderate pixel packing density; optoelectronic NOR gate pixel; optoelectronic gate technology; optoelectronic integrated circuits; optoelectronic logic gate; optoelectronic processors; output laser diode; power dissipation; processing system performance; self-electrooptic effect devices; smart pixels; total chip power dissipation; transistor circuit; Circuit analysis; Diode lasers; Integrated circuit interconnections; Integrated circuit technology; Performance analysis; Photodetectors; Power dissipation; Power system interconnection; Smart pixels; Two dimensional displays;
Journal_Title :
Lightwave Technology, Journal of