DocumentCode
988011
Title
Improving Behavioral IO Buffer Modeling Based on IBIS
Author
Varma, Ambrish K. ; Steer, Michael ; Franzon, Paul D.
Author_Institution
Cadence Design Syst., Inc., Chelmsford, MA
Volume
31
Issue
4
fYear
2008
Firstpage
711
Lastpage
721
Abstract
High level behavioral modeling is widely used in lieu of low level transistor models to ascertain the behavior of input/output (IO) drivers and receivers. The input output buffer information specification (IBIS) is one of the most widely used methodologies to model IO drivers as it satisfies the basic requirements of a behavioral model such as IP protection, simple structure, fast simulation time, and reasonable accuracy. As driver technology gets increasingly complicated and rise time of input signal gets increasingly smaller, important considerations such as simultaneous switching noise (SSN) becomes a major consideration when simulating multiple IO drivers in the integrated circuit. Unfortunately, IBIS falls short of becoming a complete IO behavioral model when simulating for SSN. This paper addresses the problem by assessing what is missing in IBIS. A method is presented for compensating for the missing information by complimenting the IBIS model with a black box that is simulator independent, without compromising with the speed that IBIS enjoys over the transistor models.
Keywords
buffer circuits; circuit simulation; industrial property; integrated circuit modelling; integrated circuit noise; IP protection; gate modulation effect; high level behavioral modeling; input output buffer information specification; input output buffer modeling; simultaneous switching noise; transistor models; Circuit simulation; Driver circuits; Integrated circuit noise; Integrated circuit technology; Mathematical model; Power system modeling; Protection; Sun; Testing; Transistors; Behavioral modeling; gate modulation effect; input output buffer information specification (IBIS); input/output (IO) buffer modeling; simultaneous switching noise (SSN);
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2008.2004995
Filename
4674530
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