Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Author

Chandrasekar, Karthik ; Wilson, John ; Erickson, Evan ; Feng, Zhiping ; Xu, Jian ; Mick, Stephen ; Franzon, Paul

Author_Institution

Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC

Volume

31

Issue

4

fYear

2008

Firstpage

749

Lastpage

758

Abstract

Multi-Gb/s pulse signaling is demonstrated with inductively coupled interconnects across packaging interfaces. This has application in realizing submillimeter pitch, true zero insertion force (ZIF) surface mount connectors, and sockets. The signaling data rate achieved in this system is from 1 to 8.5 Gbps, which depends on the 3-dB coupling frequency of the composite channel consisting of the inductive interconnections and the transmission lines. This paper presents the results of a set of experiments demonstrating this capability and describes the principles behind the design of inductively coupled sockets and connectors.

Keywords

electric connectors; signalling; surface mount technology; bit rate 1 Gbit/s to 8.5 Gbit/s; inductively coupled connectors; pulse signaling; sockets; surface mount connectors; zero insertion force; Capacitors; Connectors; Couplings; Frequency; Impedance; Integrated circuit interconnections; Optical signal processing; Packaging; Sockets; Transmission lines; 3-dB coupling frequency; alternating current (ac) coupled interconnect; backplane connectors; fine pitch; impedance matching; inductive coupling; pulse signaling; sockets; zero insertion force;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2008.2005465

Filename

4674537