• DocumentCode
    988712
  • Title

    A study of the use of local interconnect in CMOS leaf cell design

  • Author

    Bachelu, Carol ; Lefebvre, Martin

  • Author_Institution
    Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
  • Volume
    1
  • Issue
    4
  • fYear
    1993
  • Firstpage
    566
  • Lastpage
    571
  • Abstract
    A leaf-cell layout methodology for harnessing the potential of the local interconnect (LI) layer in digital CMOS circuits is presented. Based on the line-of-diffusion layout style, LI is used for selected connections, typically at the output of logic gates, in order to free up the metal-one layer in congested areas. Experimental results based on a variety of logic cells which demonstrate the benefit of the LI in terms of cell area and routing flexibility are presented. Simulation results indicate that this benefit is without any detrimental effect on electrical performance.<>
  • Keywords
    CMOS integrated circuits; circuit layout CAD; integrated circuit technology; integrated logic circuits; logic CAD; metallisation; network routing; CMOS leaf cell design; congested areas; digital CMOS circuits; leaf-cell layout methodology; line-of-diffusion layout style; local interconnect; logic gates; routing flexibility; CMOS logic circuits; Fabrication; Integrated circuit interconnections; Iterative algorithms; Logic gates; Multidimensional systems; Signal processing algorithms; Systolic arrays; Tin; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/92.250205
  • Filename
    250205