DocumentCode :
990928
Title :
Modeling and control of dispensing processes for surface mount technology
Author :
Chen, X.B. ; Schoenau, G. ; Zhang, W.J.
Author_Institution :
Dept. of Mech. Eng., Univ. of Saskatchewan, Saskatoon, Canada
Volume :
10
Issue :
3
fYear :
2005
fDate :
6/1/2005 12:00:00 AM
Firstpage :
326
Lastpage :
334
Abstract :
Dispensing is a key process in surface mount technology (SMT), in which minute amounts of fluid materials (such as solder paste, adhesive) are delivered controllably onto printed circuit boards for the purpose of conducting, bonding, etc. Time-pressure dispensing by means of pressurized air is currently the most widely used approach in SMT. Due to air compressibility, the control of the time-pressure dispensing process has proven to be a challenging task in achieving a high degree of consistency in the amount of fluid dispensed. This paper presents the development of a model of the amount of fluid dispensed by taking air compressibility into account. Based on the model, a control strategy is then developed to improve the consistency in the amount of fluid dispensed. Experiments were conducted to verify the effectiveness of the control strategy.
Keywords :
assembling; printed circuit manufacture; process control; surface mount technology; air compressibility; fluid materials; manufacturing electronic assembly; printed circuit board; surface mount technology; time pressure dispensing process; Bonding; Conducting materials; Costs; Electronic components; Fasteners; Manufacturing; Needles; Printed circuits; Process control; Surface-mount technology; Control; model; surface mount technology; time-pressure dispensing;
fLanguage :
English
Journal_Title :
Mechatronics, IEEE/ASME Transactions on
Publisher :
ieee
ISSN :
1083-4435
Type :
jour
DOI :
10.1109/TMECH.2005.848295
Filename :
1461409
Link To Document :
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