DocumentCode
990972
Title
Low Noise-Figure
AA Mesh Inductors for CMOS UWB RFIC Applications
Author
Chen, Chi-Chen ; Lee, Jen-How ; Lin, Yo-Sheng ; Chen, Chang-Zhi ; Huang, Guo-Wei ; Lu, Shey-Shi
Author_Institution
Dept. of Electr. Eng., Nat. Chi Nan Univ., Puli
Volume
55
Issue
12
fYear
2008
Firstpage
3542
Lastpage
3548
Abstract
In this paper, we demonstrate that the noise figure (NF) of a P+ active-area (AA) mesh inductor is much better than that of its standard version. In a P+AA mesh inductor, the AA with P+ implantation is added beneath it in the shape of a mesh to reduce its capacitive and magnetic coupling with the silicon substrate. Two 3.1-10.6-GHz CMOS ultrawideband (UWB) low-noise amplifiers (LNAs), one with P+ AA mesh inductors (AA mesh UWB LNA) and the other with standard inductors (STD UWB LNA), are implemented to study the effect of the P+ AA mesh on their performances. The results show that a 0.62-dB improvement in NF (from 0.8 to 0.18 dB) was achieved at 10.5 GHz for the input inductor LG1 if the P+ AA mesh had been added beneath it. In addition, the AA mesh UWB LNA achieved a low and flat NF of 3.365 plusmn 0.225 dB over the band of interest, notably better than that (4.64 plusmn 0.52 dB) of the STD UWB LNA.
Keywords
CMOS integrated circuits; inductors; low noise amplifiers; radiofrequency amplifiers; radiofrequency integrated circuits; ultra wideband technology; CMOS ultrawideband low-noise amplifiers; P+ active-area mesh inductor; RFIC amplifiers; STD UWB LNA; UWB amplifiers; frequency 10.6 GHz to 3.1 GHz; noise figure 0.8 dB to 0.18 dB; noise figure 3.365 dB to -0.225 dB; noise figure 3.365 dB to 0.225 dB; silicon substrate; standard inductors; Active inductors; Couplings; Impedance matching; Low-noise amplifiers; Noise figure; Noise measurement; Radiofrequency integrated circuits; Shape; Silicon; Ultra wideband technology; AA mesh; CMOS; inductor; low-noise amplifier (LNA); noise figure (NF); ultrawideband (UWB);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2008.2006537
Filename
4675311
Link To Document