DocumentCode
992960
Title
Short-channel modeling of bulk accumulation MOSFETs
Author
Murali, Raghunath ; Austin, Blanca L. ; Wang, Lihui ; Meindl, James D.
Author_Institution
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Volume
51
Issue
6
fYear
2004
fDate
6/1/2004 12:00:00 AM
Firstpage
940
Lastpage
947
Abstract
Physically based short-channel effect (SCE) models are derived for bulk accumulation MOSFETs. Using the proposed models, threshold voltage rolloff, subthreshold swing, and subthreshold current can be accurately calculated; this enables physical insights into device scaling behavior, and prediction of scaling limits. The models enable optimization of accumulation MOSFETs, resulting in small SCE, and low process sensitivity. The models are equally applicable to inversion MOSFETs, and allow easy comparison between accumulation and inversion MOSFETs. Novel application areas of accumulation MOSFETs are identified where they perform better than inversion MOSFETs (better on-current and lower SCE for a given off-current). With mid-band metal gate, accumulation MOSFETs perform better than inversion MOSFETs in ultra low power applications. For poly gate CMOS, accumulation MOSFETs perform better than inversion MOSFETs in low standby power applications.
Keywords
MOSFET; accumulation layers; inversion layers; low-power electronics; semiconductor device models; SCE models; bulk accumulation MOSFET; buried channel; device scaling; inversion MOSFET; low standby power applications; midband metal gate; polygate CMOS; process sensitivity; scaling limit; short-channel effect; short-channel modeling; subthreshold current; subthreshold swing; threshold voltage rolloff; ultra low power applications; CMOS technology; Conducting materials; Counting circuits; MOSFETs; Microelectronics; Predictive models; Subthreshold current; Terminology; Threshold voltage; Transconductance; Accumulation; MOSFET; buried channel; inversion; short-channel; threshold voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2004.828276
Filename
1300829
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