DocumentCode :
993016
Title :
Fermi-level pinning at the polysilicon/metal oxide interface-Part I
Author :
Hobbs, Christopher C. ; Fonseca, Leonardo R C ; Knizhnik, Andrey ; Dhandapani, Veeraraghavan ; Samavedam, Srikanth B. ; Taylor, William J. ; Grant, John M. ; Dip, LuRae G. ; Triyoso, Dina H. ; Hegde, Rama I. ; Gilmer, David C. ; Garcia, Ricardo ; Roan, Da
Author_Institution :
Technol. Solutions Group, Motorola, Austin, TX, USA
Volume :
51
Issue :
6
fYear :
2004
fDate :
6/1/2004 12:00:00 AM
Firstpage :
971
Lastpage :
977
Abstract :
We report here that Fermi pinning at the polysilicon/metal oxide interface causes high threshold voltages in MOSFET devices. Results indicate that pinning occurs due to the interfacial Si-Hf and Si-O-Al bonds for HfO2 and Al2O3, respectively. Oxygen vacancies at polysilicon/HfO2 interfaces also lead to Fermi pinning. We show that this fundamental characteristic affects the observed polysilicon depletion. In Part I, the theoretical background is reviewed and the impact of the different gate stack regions are separated out by investigating the relative threshold voltage shifts of devices with Hf-based dielectrics. The effects of the interfacial bonding are examined in Part II.
Keywords :
Fermi level; MOSFET; aluminium compounds; bonds (chemical); hafnium compounds; interface states; semiconductor-insulator boundaries; silicon; vacancies (crystal); Al2O3-Si; Fermi-level pinning; Hf-based dielectrics; HfO2-Si; MOSFET devices; Si-O-Al bonds; gate dielectric; gate stack regions; interfacial Si-Hf bonds; interfacial bonding; oxygen vacancies; polysilicon depletion; polysilicon/HfO2 interfaces; polysilicon/metal oxide interface; relative threshold voltage shifts; threshold voltages; Dielectric devices; Dielectric substrates; Hafnium oxide; Laboratories; Leakage current; MOS devices; MOSFET circuits; Oxygen; Research and development; Threshold voltage; $; Al$_2hbox O_; Fermi pinning; HfO$_2$; gate dielectric; polysilicon;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2004.829513
Filename :
1300833
Link To Document :
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