DocumentCode :
994723
Title :
Submicron filament multistrand powder metallurgy processed Cu-Nb-Sn wire
Author :
Otubo, J. ; Pourrahimi, S. ; Thieme, C.L.H. ; Zhang, H. ; Schwartz, B.B. ; Foner, S.
Author_Institution :
Pirelli, S.A. Sao Paulo, Brazil
Volume :
19
Issue :
3
fYear :
1983
fDate :
5/1/1983 12:00:00 AM
Firstpage :
764
Lastpage :
768
Abstract :
Submicron size ultrafine Cu-Nb-Sn superconducting wire has been fabricated by the powder metallurgy process simulating large scale industrial fabrication using the bundling technique. Starting copper and niobium powders ranged from 250 to 500 μm. Both external and tin core processed wires were fabricated with overall current densities of 
A/cm2at 14 T, demonstrating that both particle size and billet can be scaled up to large scale fabrication.
A/cm2at 14 T, demonstrating that both particle size and billet can be scaled up to large scale fabrication.Keywords :
Superconducting materials; Copper; Current density; Fabrication; Large-scale systems; Metals industry; Niobium; Powders; Superconducting filaments and wires; Textile industry; Tin;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.1983.1062431
Filename :
1062431
Link To Document :
