DocumentCode :
995051
Title :
Special Feature New Chip Carrier Package Concepts
Author :
Balde, John W. ; Amey, Daniel I.
Author_Institution :
Western Electric
Volume :
10
Issue :
12
fYear :
1977
Firstpage :
58
Lastpage :
68
Abstract :
The chip carrier concept was originally conceived as a square ceramic semiconductor package that could be surface reflow soldered to a ceramic substrate. Its advantages of reduced package size, higher board packing density, lower lead inductance and internal propagation delay, and easy assembly and disassembly were, unfortunately, limited to largely military applications.
Keywords :
Assembly; Bonding; Ceramics; Electronics packaging; Gold; Metallization; Nonhomogeneous media; Printed circuits; Semiconductor device packaging; Substrates;
fLanguage :
English
Journal_Title :
Computer
Publisher :
ieee
ISSN :
0018-9162
Type :
jour
DOI :
10.1109/C-M.1977.217602
Filename :
1646335
Link To Document :
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