DocumentCode :
996628
Title :
A 130-nm RHBD SRAM With High Speed SET and Area Efficient TID Mitigation
Author :
Mohr, Karl C. ; Clark, Lawrence T. ; Holbert, Keith E.
Author_Institution :
Arizona State Univ., Tempe
Volume :
54
Issue :
6
fYear :
2007
Firstpage :
2092
Lastpage :
2099
Abstract :
A radiation hardened by design 5 kB static random access memory appropriate for embedded system on a chip integrated circuits is presented. High speed dual redundant control logic suppresses single event transients, allowing 500 MHz operation. Dynamic supply modulation, reverse body bias, and array supply collapse are investigated, in place of annular layout, to suppress leakage current increases due to total ionizing dose effects. These approaches allow the use of two-edge NMOS transistor layout resulting in increased packing density. The design has been fabricated using a 130-nm bulk CMOS process; the parts were then tested and found to be functional. Experimental results from TID testing using a Co-60 gamma radiation source as well as heavy ion testing results are presented.
Keywords :
MOSFET; SRAM chips; ion beam effects; leakage currents; radiation hardening (electronics); CMOS; SRAM; array supply collapse; chip integrated circuits; dynamic supply modulation; frequency 500 MHz; gamma radiation source; heavy ion testing; high speed dual redundant control logic; ionizing dose; leakage current; packing density; radiation hardened; reverse body bias; single event transients; size 130 nm; two-edge NMOS transistor layout; CMOS process; Embedded system; Gamma rays; Leakage current; Logic; MOSFETs; Radiation hardening; Random access memory; SRAM chips; Testing; Radiation hardening; single event transient; static random access memory; total ionizing dose;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2007.910867
Filename :
4395062
Link To Document :
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